Ho tloha ka 2025, theknoloji ea Thermoelectric Cooling (TEC) e entse tsoelo-pele e kholo thepa, moralo oa meaho, tšebeliso e ntle ea matla le maemo a ts'ebeliso. Tse latelang ke mekhoa ea morao-rao ea nts'etsopele ea theknoloji le lintlafatso tse teng hona joale.
I. Ntlafatso e tsoelang pele ea melao-motheo ea bohlokoa
Phello ea Peltier e ntse e le ea bohlokoa: ka ho khanna lipara tsa semiconductor tsa mofuta oa N/P (tse kang thepa e thehiloeng ho Bi₂Te₃) ka motlakase o tobileng, mocheso o lokolloa pheletsong e chesang 'me o monngoa qetellong e batang.
Bokhoni ba taolo ea mocheso oa mahlakoreng a mabeli: E ka fihlella ho pholisa/ho futhumatsa ka ho fetola tsela ea hona joale, 'me e sebelisoa haholo maemong a taolo ea mocheso o nepahetseng haholo.
II. Lintlafatso tse kholo thepeng ea thepa
1. Thepa e ncha ea thermoelectric
Bismuth telluride (Bi₂Te₃) e ntse e le yona e ka sehloohong, empa ka boenjiniere ba nanostructure le optimization ya doping (jwalo ka Se, Sb, Sn, jj.), boleng ba ZT (boleng bo nepahetseng ba coefficient) bo ntlafaditswe haholo. ZT ya disampole tse ding tsa laboratori e feta 2.0 (ka setso e ka ba 1.0-1.2).
Ntlafatso e potlakileng ea lisebelisoa tse ling tse se nang loto/tse nang le chefo e tlase
Lisebelisoa tse thehiloeng ho Mg₃(Sb,Bi)₂
Kristale e le 'ngoe ea SnSe
Motsoako oa halofo ea Heusler (o loketseng likarolo tse nang le mocheso o phahameng)
Lisebelisoa tse kopaneng/tse nang le gradient: Meaho e fapaneng ea mekhahlelo e mengata e ka ntlafatsa ho tsamaisoa ha motlakase le ho tsamaisoa ha mocheso ka nako e le 'ngoe, e leng se fokotsang tahlehelo ea mocheso oa Joule.
III, Mekhoa e mecha tsamaisong ea sebopeho
1. Moralo oa Thermopile ea 3D
Amohela meaho e kopaneng ea stacking e otlolohileng kapa micro channel ho ntlafatsa bongata ba matla a ho pholisa ka sebaka sa yuniti.
Mojule oa TEC oa cascade, mojule oa peltier, sesebelisoa sa peltier, mojule oa thermoelectric o ka fihlella mocheso o tlase haholo oa -130℃ 'me o loketse lipatlisiso tsa saense le ho hoamisa bongaka.
2. Taolo e tloaelehileng le e bohlale
Sensor e kopaneng ea mocheso + algorithm ea PID + drive ea PWM, e fihlella taolo ea mocheso e nepahetseng haholo ka har'a ±0.01℃.
E tšehetsa taolo e hole ka Inthanete ea Lintho, e loketse ketane e bohlale ea serame, lisebelisoa tsa laboratori, jj.
3. Ntlafatso e kopanetsoeng ea taolo ea mocheso
Phetisetso ea mocheso e ntlafalitsoeng ea pheletso e batang (microchannel, thepa ea phetoho ea mohato PCM)
Karolo e chesang e amohela li-sink tsa mocheso tsa graphene, likamore tsa mouoane kapa li-micro-fan arrays ho rarolla bothata ba "ho bokellana ha mocheso".
IV, maemo a ts'ebeliso le masimo
Tlhokomelo ea bongaka le ea bophelo bo botle: lisebelisoa tsa thermoelectric PCR, lisebelisoa tsa botle tsa laser tse pholileng ka thermoelectric, mabokose a lipalangoang a nang le ente e pholileng
Puisano ea mahlo: Taolo ea mocheso oa mojule oa optical oa 5G/6G (ho tsitsisa bolelele ba lebone la laser)
Lisebelisoa tsa elektroniki tsa bareki: Li-clip tsa ho pholisa lifono tsa selefouno, ho pholisa li-headset tsa thermoelectric AR/VR, lihatsetsi tse nyane tsa ho pholisa tsa peltier, sehatsetsi sa veine se pholisang sa thermoelectric, lihatsetsi tsa likoloi
Matla a macha: Ntloana ea mocheso o sa fetoheng bakeng sa libeteri tsa drone, pholiso ea lehae bakeng sa matloana a likoloi tsa motlakase
Theknoloji ea lifofane: ho pholisa ka thermoelectric ha lisebelisoa tsa ho lemoha mahlaseli a sathelaete, taolo ea mocheso tikolohong ea matla a khoheli a liteishene tsa sepakapaka
Tlhahiso ea semiconductor: Taolo ea mocheso o nepahetseng bakeng sa mechini ea photolithography, li-platform tsa liteko tsa wafer
V. Liphephetso tsa Theknoloji tsa Hona Joale
Bokgoni ba matla bo ntse bo le tlase ho feta ba sehatsetsi sa compressor (hangata COP e ka tlase ho 1.0, ha compressor e ka fihla ho 2-4).
Litšenyehelo tse phahameng: Thepa e sebetsang hantle le sephutheloana se nepahetseng li phahamisa litheko
Ho qhalana ha mocheso qetellong e chesang ho itshetlehile ka sistimi ya kantle, e fokotsang moralo o monyane
Ho tšepahala ha nako e telele: Ho potoloha ha mocheso ho baka mokhathala oa manonyeletso a solder le ho senyeha ha thepa
VI. Tataiso ea Nts'etsopele ea Bokamoso (2025-2030)
Thepa ea thermoelectric ea mocheso oa kamore e nang le ZT > 3 (Katleho ea moeli oa khopolo-taba)
Lisebelisoa tsa TEC tse tenyetsehang/tse aparoang, li-module tsa thermoelectric, li-module tsa peltier (bakeng sa letlalo la elektroniki, tlhokomelo ea bophelo bo botle)
Sistimi ea taolo ea mocheso e ikamahanyang le maemo e kopantsoeng le AI
Theknoloji ea tlhahiso le ho sebelisa hape e tala (Ho Fokotsa Maoto a Tikoloho)
Ka 2025, theknoloji ea ho pholisa ea thermoelectric e ntse e fetoha ho tloha ho "taolo ea mocheso e nepahetseng le e nepahetseng" ho ea ho "ts'ebeliso e sebetsang hantle le e kholo". Ka ho kopanngoa ha saense ea thepa, ts'ebetso ea micro-nano le taolo e bohlale, boleng ba eona ba maano masimong a kang sehatsetsi sa zero-carbon, ho qhala ha mocheso oa elektroniki ka ts'epo e phahameng le taolo ea mocheso libakeng tse ikhethang ho ntse ho hlahella haholo.
Tlhaloso ea TES2-0901T125
Tekanyo e phahameng ka ho fetisisa: 1A,
Umax: 0.85-0.9V
Qmax: 0.4 W
Max ea Delta T:>90 C
Boholo: Boholo ba motheo: 4.4 × 4.4mm, boholo bo holimo 2.5X2.5mm,
Bolelele: 3.49 mm.
Tlhaloso ea TES1-04903T200
Mocheso o chesang oa lehlakore ke 25 C,
Polelo e phahameng ka ho fetisisa: 3A,
Umax: 5.8 V
Qmax: 10 W
Tekanyo e phahameng ea Delta T:> 64 C
ACR: 1.60 Ohm
Boholo: 12x12x2.37mm
Nako ea poso: Tshitwe-08-2025
