Sehatsetsi sa Peltier, sesebelisoa sa peltier, module ea thermoelectric (TEC) li sebelisa melemo ea tsona ea mantlha ea ho ba le boemo bo tiileng ka botlalo, ntle le ho thothomela, ka nako ea karabelo ea millisecond, taolo e nepahetseng ea mocheso ea ±0.01℃, le taolo ea mocheso ea mahlakoreng a mabeli, e leng tharollo ea bohlokoa bakeng sa taolo e nepahetseng ea mocheso, ho qhala ha mocheso sebakeng seo, le taolo e feteletseng ea mocheso oa tikoloho masimong a theknoloji e phahameng. Li akaretsa makala a mantlha a kang puisano ea optical, 5G, le litsi tsa data.
1. Puisano ea Optical le 5G / Litsi tsa Data (Liketsahalo tsa Bohlokoa Tse Hlokahalang)
Micro TEC, mojule o monyenyane wa thermoelectric, mojule o monyenyane wa peltier bakeng sa di-chip le di-detector tsa laser tsa DFB/EML: Fana ka mocheso o sa fetoheng wa ±0.1℃ ho thibela ho sisinyeha ha wavelength le ho netefatsa matshwao a optical a tsitsitseng a sebaka se selelele/lebelo le phahameng (400G/800G); tshebediso ya matla a mojule o le mong < 1W, karabelo < 10ms.
Li-amplifier tsa motlakase tsa seteishene sa motheo sa 5G / RF: Ho qhala ha mocheso sebakeng sa heno bakeng sa li-amplifier tsa motlakase tsa GaN le li-antenna tse arotsoeng ka mekhahlelo. Mojule o le mong oa 40mm×40mm TEC, mojule oa thermoelectric (peltier cooler) o ka fokotsa mocheso oa junction ka 22℃ mojarong oa mocheso oa 80W, ho ntlafatsa ts'epo ea sistimi ka 30%.
Kgokelo ya optical setsing sa data: Taolo ya mocheso bakeng sa di-module tsa optical tse kentsweng ka rack tse nang le bongata bo boholo, e nkela sebaka sa ho phodisa metsi ho sebetsana le di-hotspots tsa lehae le dithibelo tsa sebaka.
II. Tlhahiso ea Semiconductor le Pakete e Tsoetseng Pele (Netefatso ea Ts'ebetso e Phahameng)
Tšebeliso ea Lithography / Khomaretsi / Nts'etsopele: Tšebeliso ea photoresist, taolo ea mocheso oa mokelikeli oa CMP polishing, ka liphetoho tse bolokiloeng ka hare ho **±0.1℃**, ho thibela ho fetoha ha chip le ho se tsitse ha bokaholimo ho feta maemo a tloaelehileng ka lebaka la khatello ea mocheso.
Teko ea Wafer / Botsofali: Taolo e nepahetseng ea mocheso oa benche ea teko ea botsofali le seteishene sa probe, ho netefatsa sekhahla se tsitsitseng sa chai. Lisebelisoa tsa lapeng li fihletse phetolo ea thepa e tsoang kantle ho naha.
Sephutheloana se Tsoetseng Pele (3D/Chiplet): Ho qhalana ha mocheso sebakeng seo le ho leka-lekana ha mocheso pakeng tsa di-chip tse betlilweng ho rarolla bothata ba ho se tshwane ha mocheso disebedisweng tse fapaneng.
III. Bongaka le Saense ea Bophelo (Taolo e Nepahetseng ea Mocheso + Phetoho e Potlakileng ea Mocheso)
Tatellano ea PCR / Genetic: Ho phahama le ho theoha ha mocheso ka potlako (-20℃ ~ 105℃), ho nepahala ha taolo ea mocheso ± 0.3℃. Ena ke yuniti ea taolo ea mocheso ea mantlha bakeng sa ho holisa nucleic acid le tatellano ea DNA.
Litšoantšo tsa Bongaka (CT/MRI/Ultrasound): Ho pholisa lipeipi tsa X-ray sebakeng seo, limakenete tse tsamaisang lintho tse ngata, le mocheso o sa fetoheng oa li-probe tsa ultrasound, ho ntlafatsa botsitso ba motlakase oa lipeipi ho fihlela ho 99.5%, le ho eketsa nako ea ts'ebetso e tsoelang pele.
Disampole tsa Baeloji / Polokelo ea Ente: Mefuta e fapaneng ea mocheso (-80℃ ~ 200℃), polokelo e se nang ho thothomela, e loketse liente tsa mRNA, lisele tsa kutu, le lisampole tsa protheine bakeng sa polokelo ea ketane e batang le laboratori.
Lisebelisoa tsa ho Buoa / Kalafo ea Mocheso o Tlase: Taolo ea mocheso oa lisebelisoa tsa ho buoa tse sa hlaseleng haholo, lisebelisoa tsa plasma / cryotherapy tsa mocheso o tlase, ho fihlella pholiso e nepahetseng ea sebakeng seo.
IV. Lisebelisoa tsa Optoelectronics tsa Laser le Infrared (Boleng ba Mahlaseli + Kutloisiso ea ho Lemoha)
Li-laser tsa indasteri/tsa lipatlisiso: Faeba, Boemo bo tiileng, Li-resonator tsa laser tse potlakileng haholo / Mocheso o sa fetoheng oa Gain Medium, Boleng ba mahlasedi M² Phapang < ± 0.02, Botsitso ba Wavelength < 0.1nm.
Di-Detector tsa Infrared (Mofuta o Phodileng): InGaAs, Di-Detector tsa MCT tse Phodisang ka ho Tebileng (190K – 250K), Ntlafatsa ho Itshwaya ka Infrared / Kutloisiso ya Remote Sensitivity, e Sebedisetswa Tshireletso, Bolepi ba Dinaledi, Tlhahlobo ya Sesole.
Lidar (LiDAR): Mokhahlelo oa Likoloi / Mokhahlelo oa Lidar Transmitter / Receiver Modules Taolo ea Mocheso, Ikamahanya le Maemo a Feteletseng a -40°C ho isa ho 85°C, Netefatsa ho Nepahala ha Sebaka sa Tekanyo.
V. Lifofane le Tšireletso (Litikoloho tse Feteletseng + Tšepo e Phahameng)
Lisathelaete/Lifofane: Lik'hamera tse ka hare ho sekepe, mojaro oa puisano, litsamaiso tsa ho tsamaea tse sa sebetseng tse nang le taolo ea mocheso, tse khonang ho mamella vacuum, liphetoho tse feteletseng tsa mocheso (-180°C ho isa ho 120°C), ntle le likarolo tse tsamaeang, tse nang le bophelo ba lihora tse fetang 100,000.
Lisebelisoa tsa Elektroniki tsa Airborne/Shipborne: Li-radio, puisano, ho pholisa lisebelisoa tsa taolo ea mollo, tse hanelang ho thothomela le ho tetebela, tse fihlelang litlhoko tsa ho tšepahala tsa boemo ba sesole.
Ho Hlahloba Sebaka se Tebileng: Likarolo tsa lisebelisoa bakeng sa li-rover tsa Mars le li-rover tsa khoeli tse nang le taolo ea mocheso, ho sebelisoa module ea ho pholisa ea thermoelectric, module ea thermoelectric, sesebelisoa sa peltier, karolo ea peltier, module ea TEC bakeng sa taolo ea mocheso oa mahlakoreng a mabeli ho fihlela tekano ea mocheso oa motšehare le bosiu.
VI. Likoloi tse Ncha tsa Matla le Sebaka sa ho Koka se Bohlale (Ntlafatso ea Tsamaiso ea Thermal)
Sephutheloana sa Betri: Taolo e nepahetseng ea mocheso oa lehae bakeng sa lisele/li-module (25℃ ± 2℃), e ntlafatsang bokhoni ba ho tjhaja ka potlako, bophelo ba potoloho, le ts'ebetso ea ho ntša mocheso o tlase.
Sekoti se bohlale sa Cockpit: Li-screen tsa OLED/Mini LED center, mabone a AR HUD a nang le taolo e sa fetoheng ea mocheso (<35℃), a thibelang ho chesoa ha skrine le ho ntlafatsa ho nepahala ha 'mala; BYD Haolei Ultra e kopantse letoto la TEC le tšesaane haholo (botenya ba 1.2mm).
Radar ea Laser ea Koloi / Taolo ea Domain: Li-chip tsa k'homphieutha tse sebetsang hantle, ho qhala mocheso oa sensor, ho netefatsa kutloisiso e tsitsitseng le ho etsa liqeto bakeng sa ho khanna ka boikemelo.
VII. Lisebelisoa tsa Elektroniki tsa maemo a holimo le tse nepahetseng (Libaka tse chesang tsa lehae + Ha ho na ho thothomela)
Khomphutha e sebetsang hantle (HPC/AI): Ho qhala mocheso sebakeng sa heno bakeng sa GPU/CPU, di-chip tsa ASIC, ho sebetsana le mahloriso a hotspot ka har'a sephutheloana sa 3D le Chiplet, ka ho nepahala ha taolo ea mocheso oa **±0.1℃**.
Disebediswa tse nepahetseng tsa ho lekanya/ho bona: Interferometer, microscope e nepahetseng haholo, taolo ya mocheso wa spectrometer, ho fedisa ho thella ha mocheso, ho nepahala ha tekanyo ho fihlella boemo ba nanometer.
E ka aparoang / AR/VR: Mojule o pholileng oa thermoelectric o monyenyane, mojule o motlakase o moholo, mojule o motlakase o monyenyane o moholo, TEC e nyane bakeng sa li-headset, lioache tse bohlale bakeng sa ho qhala mocheso sebakeng seo le taolo ea mocheso oa 'mele oa motho, ho ntlafatsa boiketlo ba ho roala.
VIII. Maemo a mang a morao-rao
Khomphutha ea quantum / Superconductivity: Li-bit tsa quantum, li-chip tse tsamaisang superconductor tse nang le taolo ea mocheso o tlase (mK ho isa ho K) ho thibela lerata la mocheso.
Matla a macha (photovoltaic / polokelo ea matla): Ho pholisa pampiri e ka morao ea mojule oa photovoltaic, ho qhala ha mocheso oa sesebelisoa sa ho fetola matla (PCS), ho ntlafatsa katleho ea phetoho.
Microfluidics / Laboratori ea Chip: Taolo e nepahetseng ea mocheso oa li-microchannel le likamore tsa karabelo, tse sebelisetsoang ho kopanya lik'hemik'hale le ho hlahloba lithethefatsi.
Melemo ea mantlha ea tekheniki (senotlolo sa ho ikamahanya le maemo a tsoetseng pele)
Boemo bo tiileng ka ho felletseng: Ha ho na compressor, ha ho na refrigerant, ha ho thothomelo, lerata le tlase, e loketse tikoloho e nepahetseng / e hloekileng.
Ho tobetsa ka ho toba mahlakoreng a mabeli: Ho tobetsa hanngoe pakeng tsa ho pholisa le ho futhumatsa, ho nepahala ha taolo ea mocheso oa ± 0.01℃, nako ea karabelo < 10ms.
Miniaturization: Boholo bo fokolang ba 1×1mm, botenya < 0.5mm, bo loketse ho kopanngoa ha bongata bo boholo.
Tšepo e phahameng: Ha e senyehe ka mechine, nako ea bophelo e ka ba lihora tse fetang 100,000, e ikamahanya le mocheso o feteletseng le mongobo le tikoloho ea ho thothomela.
Nako ea poso: Hlakola-17-2026
